Comprehensive Guide to High-Purity Reagents: Classification, Standards, and Industrial Applications

1. Definition and Core Value of High-Purity Reagents

High-purity reagents are specialty chemicals with purity levels significantly exceeding "analytical grade" standards. Characterized by ultra-low impurity concentrations (controlled at ppm to ppb levels, 99.95%–99.9999%), these materials are engineered through advanced purification processes. Unlike reference standards that prioritize main component accuracy, high-purity reagents focus on minimizing 22+ critical contaminants (e.g., metal ions, particulate matter), making them indispensable in semiconductor fabrication, optoelectronics, and precision instrumentation.

2. Grading Systems and Quality Control Protocols

Globally recognized "N-number grading" quantifies purity using 9-based scales:

• 3.5N Grade (99.95%): Total impurities ≤1.5×10⁻²>#/p###
• 4N Grade (99.99%): Total impurities ≤1.0×10⁻²>#/p###
• 5N Grade (99.999%): Total impurities ≤1.0×10⁻³>#/p###

Certification requires cutting-edge analytical methods:

• ICP-MS (Inductively Coupled Plasma Mass Spectrometry)
• GD-MS (Glow Discharge Mass Spectrometry)
• LPC (Liquid Particle Counting) compliant with SEMI F73 standards

3. Five Major Classifications and Industrial Applications

3.1 Basic High-Purity Chemicals (4N–6N)

• Components: Metal ingots (e.g., 6N aluminum), oxides (e.g., SiO₂), inorganic salts
• Applications: Nuclear shielding materials, semiconductor substrates, reference solutions
• Key Metrics: Main content ≥99.99%, metallic impurities ≤10 ppm

3.2 Ultra-Clean Electronic-Grade Reagents (SEMI Standards)

• Grades:
  • BV-I: ≤25 particles/ml (0.5 µm), for 1.2 µm IC processes
  • BV-III: ≤5 particles/ml, compatible with 0.18 µm nodes
• Breakthrough: PRONOVATION’s MOS-grade reagents achieve ≤0.1 ppb metal impurities

3.3 Photoresist Ancillaries

• Types: Positive/negative resists, DUV/EUV lithography formulations
• Critical Specs: Moisture ≤1 ppm, ionic contaminants ≤0.5 ppm
• Innovation: Halogen-free developers for 3D NAND architectures

3.4 CMP Slurries

• Systems:
  • Abrasives: Colloidal silica (Φ50 nm) / ceria nanoparticles
  • Carriers: pH-stabilized aqueous/organic suspensions
• Performance: Surface roughness ≤0.1 nm (Ra), defect density ≤0.05/cm²

3.5 Liquid Crystal Materials

• Categories: TN/STN/TFT-grade monomers (biphenyl, fluorinated cyclohexanes)
• Purity Requirements:
  • Monomer content ≥99.9>#/p###
  • Ion contamination ≤1 ppb
  • Water content ≤5 ppm
• Emerging Use: Cholesteric LC sensors for early-stage cancer detection

4. Selection Strategies for Industry 4.0

1. Process Alignment:
   • 300mm wafer fabs require SEMI G5-certified chemicals
   • TFT-LCD production mandates G6+ purity for gate insulator layers
2. Supply Chain Compliance:
   • Verify ISO 9001/14001/IATF 16949 certifications
   • Prioritize vendors with on-site contamination control labs
3. Technology Roadmap:
   • Monitor innovations in EUV photoresist strippers (sub-5 nm nodes)
   • Evaluate low-k dielectric CMP slurries for advanced packaging

PRONOVATION’s Competitive Advantages

As a leading chemical supplier, we deliver: 

✅ 2,000+ High-Purity Products with full SEMI/GJB documentation 

✅ In-House Analytical Lab (ISO/IEC 17025 accredited) 

✅ Particle-Free Packaging (Class 1 cleanroom filling) 

✅ Custom Solutions for III-V semiconductors and flexible displays

Contact Us Today for:

• Free technical consultation with PhD-level chemists
• Batch-specific COA (Certificate of Analysis) access
• Sample requests for qualification trials

PRONOVATION Chemical B2B Platform Qingdao Pronovation Technology Co., Ltd. Your Partner in Precision Chemistry Solutions